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reflow soldering

Inline Vacuum soldering systems KD-V400

KD-V400
Model: KD-V400
Welding size: 350*400MM 
Gas: Nitrogen ,Formic acid
Control system: Siemens PLC1200 control system +YanHua IPC +Software operate
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Inline Vacuum Reflow Oven KD-V400

 
KD-V400 series solder machine features four separate process chambers, in-line substrate handling, and in-line carrier transfer for highly efficient series production. Continuously soldering preforms and/or pastes is possible with the system. Permanent process monitoring guarantees soldering reproducibility.
 
 
 
 
 

Technical Parameters

Name

Vacuum soldering systems

Model

KD-V400

Welding size

350*400MM 

Oven size (LxWxH)

3950*1960*1900mm  Connected unloader size:4580*1960*1900 mm

Weight

2900 kgs

Heating zones

Front two preheating zones, Middle is Reflow zone, Behind are 4 Cooling chambers. Each temperature zone independent vacuum, Independent temperature control system. Products left in -right out, inline working.

Compatible Process

Solder paste and Preform solder

Gas

Nitrogen; Formic acid

Feed in and out

With 0.6m uploader,1.2m unloader , Air-cooling with time setting

Track

Length:330mm，Adjustable;Height:950±20mm;Carring capacity≥20kg

Effectively heating space

(280mm*190mm)*2 heating zone ,H≥80mm；

Height of Chamber

80mm

Max temperature of Preheating zone and Reflow zone

≥400℃;Accuracy:±1℃；

Bottom welding temperature

≥450℃

Top welding temperature

Max 300℃

Heating way

Bottom contact-type heating conduction

Cooling way

Bottom contact-type cooling

Type of Vacuum pump.  Speed

With 4 oil pump( 2 Preheating zones/Reflow zone/Cooling zone,) Speed ≥100m3/h;

Min Vacuum

2 Preheating zone/Reflow zone/ Cooling zone ≤1mbar; Within2h≤5mbar；

Speed of Heating and Cooling

Max heating speed≥3℃/s; Max cooling speed≥3℃/s。

Accuracy of Soldering temperature

Temperature of Reflow tray:±2%

Max hold time of reflow temperature

≥60min,(Max：999s)；

Void Rate

Whole Void rate ≤2% Chip size (10mm*10mm),Sigle Void rate≤1% ,Chip size:(10mm*10mm)

Cooling Water

With independent circulating cooling water system

Temperature curve

Can setting self,(Add/Modify/Delete and so on)

Chamber with watch window

Chamber with watch window

Power

Max:35KW   Working powe:12-15KW

Heating platform

Red copper special treatment

Power standard

380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire

Gas

Nitrogen ,Formic acid

Control system

Siemens PLC1200 control system +YanHua IPC +Software operate

 
              
 

Temperature uniformity of test platform ( six points),temperature measuring copper block distributed at different position of the platform, Result of test: Temperature uniformity of tray six position＜4 °.
 
Standard for delivery:
 
  1. Vibration testing requires that vibrate peak value during track operation  below 300 microns, which is considered qualified.
  2. It is require that the vibration peak value should be below 300 microns for  different chamber and at different speed.
  3. For example : Under 4 kinds speed 15/20/25/30 for  Preheating chamber , soldering  chamber, Cooling chamber  use individual vibration testing and continuous vibration testing , need both meet technical demand.

    

    

After soldering：Single void rate＜1%，Whole void rate＜ 2% (use our vacuum soldering systems)

Vacuum Refow Ovens Comparing

TypeKD-V300KD-V400
Heating zonesFront is the preheating zone, Middle is the Reflow zone, Behind is the Cooling zonesFront two preheating zones, Middle is Reflow zone, Behind are 4 Cooling chambers.
Welding size350*400MM 350*400MM 
PowerMax:28KW   
Working powe:8-10KW		Max:35KW  
Working powe:12-15KW
 
 
 Features of Reflow Solder Machine
  • Void-free solder connections
  • Soldering with preforms and/or pastes
  • Process temperatures up to 300 °C
  • Controlled temperature gradients
  • Short cycle times
  • Separate soldering and cooling chamber
  • Flux-free soldering with formic acid
  • Reproducibility of the soldering results
  • Traceability
  • Permanent process control
  • Viewing system
  • Independent temperature control system
 
 
 
Frequently Asked Questions
 
1. What is Reflow Soldering?
 
Reflow soldering involves applying solder paste to PCB contact pads. It also involves placing the electrical components on it, and melting the solder paste to connect the components.One major difference between reflow soldering and traditional soldering is that heated air is used to melt the solder instead of a soldering iron.In a reflow oven with an infrared lamp, the entire assembly is heated, melting the solder and joining the electrical components.Furthermore, you can regulate the infrared lamp's temperature to prevent thermal shock from breaking the board.By using the reflow soldering technique, thermal shock can be prevented.weakens and breaks joints easily.d break easily.
 
2. What Are The Advantages Of HVT China Reflow Soldering Machines?
 
Compared to Pink's VADU 400XL, KD-V400 is a china nitrogen reflow oven for mass production and has been upgraded and optimized.
 
  1. Temperature control advantage: There are nine heating rods on our product's bottom heating plate, each of which has a control system that is independent. This effectively resolves the issue of low platform temperatures at the edges and a significant temperature difference between the edges and the center. As a result, our product provides more uniform heating, ensuring consistent temperature across the platform and improving soldering quality.
  2. Flexible workflow: The china reflow soldering machine automatically stops during the working process if any issues arise, so that we can analyze the problem. During a segmented process, operators can choose any segmented process to continue the work if the problem does not affect soldering quality. When the problem is serious, alternative materials can be selected directly. This facilitates workflow efficiency and reliability.
  3. Vacuum control advantage: By adjusting the vacuum speed between 0-100%, we address the chip displacement issue during rapid pressure reduction. As a result, vacuum evacuation of molten solder can be controlled more efficiently, reducing the void formation, ensuring better quality and control during the soldering process.
 
 
 
 
 
 
 

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