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IGBT power device vacuum soldering system

Formic Acid Vacuum Reflow Oven KD-V300 HVT

KD-V300
Model: KD-V300
Welding size: 350*400MM
Sigle Void rate: ≤1%
Gas: Nitrogen ,Formic acid
Control system: Siemens PLC1200 control system
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Formic Acid Vacuum Reflow Oven KD-V300

 
 
Our formic acid vacuum reflow oven be good at working for igbt power device with formic acid and nitrogen, effectively reduce the void rate , prevent the products from oxidation.
 
 
Technical parameters
 
Name
Vacuum Reflow Oven
Model
KD-V300
Welding size
350*400MM 
Oven size (LxWxH)
3200*1850*1900mm  Connected unloader size:3880*1850*1900 mm
Weight
2600 kgs
Heating zones
Front is the preheating zone, Middle is the Reflow zone, Behind is the Cooling zones. Each temperature zone independent vacuum, Independent temperature control system. Products left in -right out, inline working.
Compatible Process
Solder paste and Preform solder
Gas
Nitrogen; Formic acid
Feed in and out
With 0.6m uploader,1.2m unloader , Air-cooling with time setting
Track
Length:330mm，Adjustable;Height:950±20mm;Carring capacity≥20kg
Effectively heating space
(280mm*190mm)*2 heating zone ,H≥80mm；
Height of Chamber
80mm
Max temperature of Preheating zone and Reflow zone
≥400℃;Accuracy:±1℃；
Bottom welding temperature
≥450℃
Top welding temperature
Max 300℃
Heating way
Bottom contact-type heating conduction
Cooling way
Bottom contact-type cooling
Type of Vacuum pump.  Speed
With 3 oil pump( Preheating zone/Reflow zone/Cooling zone,) Speed ≥100m3/h;
Min Vacuum
Preheating zone/Reflow zone/ Cooling zone ≤1mbar; Within2h≤5mbar；
Speed of Heating and Cooling
Max heating speed≥3℃/s; Max cooling speed≥3℃/s。
Accuracy of Soldering temperature
Temperature of Reflow tray:±2%
Max hold time of reflow temperature
≥60min,(Max：999s)；
Void Rate
Whole Void rate ≤2% Chip size (10mm*10mm),Sigle Void rate≤1% ,Chip size:(10mm*10mm)
Cooling Water
With independent circulating cooling water system
Temperature curve
Can setting self,(Add/Modify/Delete and so on)
Chamber with watch window
Chamber with watch window
Power
Max:28KW   Working powe:8-10KW
Heating platform
Red copper special treatment
Power standard
380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire
Gas
Nitrogen ,Formic acid
Control system
Siemens PLC1200 control system+YanHua IPC +Software operate
 
Detail Display
 
Temperature uniformity of test platform ( six points),temperature measuring copper block distributed at different position of the platform, Result of test: Temperature uniformity of six position＜4 °.
 
 
 

     

Soldering void rate＜1%

Systems Comparing

TypeKD-V300KD-V400

Heating zones

Front is the preheating zone, Middle is the Reflow zone, Behind is the Cooling zonesFront two preheating zones, Middle is Reflow zone, Behind are 4 Cooling chambers
Welding size350*400MM 350*400MM 
PowerMax:28KW   
Working powe:8-10KW		Max:35KW  
Working powe:12-15KW
 
Features Of Void-Free Reflow Oven
 
  • Void-free solder connections
  • Soldering with preforms and/or pastes
  • Process temperatures up to 300 °C
  • Controlled temperature gradients
  • Short cycle times
  • Separate soldering and cooling chamber
  • Flux-free soldering with formic acid
  • Reproducibility of the soldering results
  • Traceability
  • Permanent process control
  • Viewing system
  • Independent temperature control system
 

Our Advantages

 
KD-V300, as an automated online system for mass production, has been upgraded and optimized from Pink's VADU300KL/400X to the KD-V300. In comparison to Pink, we have the following advantages over them:
 
  1. Temperature control advantage: Our product features 9 heating rods on the bottom heating plate, grouped into sets of 3, each with an independent control system. This effectively addresses the issue of low temperature at platform edges and a significant temperature difference between the edges and the center. As a result, our product provides more uniform heating, ensuring consistent temperature across the platform and improving soldering quality.
  2. Flexible workflow: During the working process, if any issues arise, our machine automatically stops, allowing for problem analysis. If the problem does not affect soldering quality, operators can select any segmented process to continue the work, saving time and materials. In more serious cases, alternative materials can be selected directly. This flexibility enhances workflow efficiency and reliability.
  3. Vacuum control advantage: Our product allows for the adjustable vacuum speed between 0-100%, addressing the issue of chip displacement during rapid pressure reduction. Additionally, during the vacuum evacuation of molten solder, it enables better control of the evacuation speed, reducing void formation. This ensures improved control and quality during the soldering process.
 
Frequently Asked Questions
 
1. What is an IGBT power device vacuum soldering system?
 
IGBT power device vacuum soldering systems are specialized equipment for soldering IGBT power devices in a vacuum environment. In addition to preventing oxidation and ensuring high-quality solder joints, this system creates an oxygen-free atmosphere during soldering.devices can be improved in reliability and performance with vacuum soldering, msoldering. This makesakesfor sensitive electronic applications, such as power electronics, motor drives, and renewable energy systems. In addition to ensuring precise soldering, it minimizes the riskdefect risk, to robust and efficient electronic components.
 
2. What are the benefits of using a vacuum soldering system for IGBT power devices?
 
Using a vacuum soldering system for IGBT power devices offers several significant benefits:
 
  • Oxidation prevention: IGBT power devices are designed to ensure high-quality solder joints and long-term reliability through a vacuum environment, which eliminates oxygen.
  • Improved solder wetting: Solder wetting is more consistent resulting in stronger and more consistent connections between the IGBT and the PCB.
  • Reduced Void Formation: Vacuum soldering helps reduce void formation in the solder joints, which is crucial for maintaining thermal and electrical conductivity, enhancing the overall performance of the IGBT power devices.
  • Enhanced ElectricaPeelectrical performance: IGB devices power losses and improved efficiency when there are fewer voids and improved solder quality.
  • Hermetic Sealing: Vacuum soldering can achieve hermetic sealing of the IGBT power devices, preventing the entry of moisture or contaminants, which is especially crucial for applications in harsh environments.
  • Soldering of Sensitive Components: As IGBTs are sensitive to high temperatures and atmospheric conditions, vacuum soldering allows precise control over the soldering process, reducing trisk of damage tthe risk device.sk.
  • Consistency and Reproducibility: The vacuum soldering process ensures uniform solder joints across multiple IGBT power devices in a production batch, ensuring consistent and reproducible results.
 
 

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