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reflow equipment

Vacuum Reflow Oven KD-V43 HVT

KD-V43
Model: KD-V43
Welding size: 400*300MM
Lateral temperature difference: ±5℃
Gas: Nitrogen system
Control system: Siemens PLC+IPC
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Technical Parameters

 

Name

Vacuum Reflow Oven

Model

KD-V43

Welding size

 400*300mm

Gas

Nitrogen system

Oven size (LxWxH)

1480*990*1300mm

Weight

260kgs

Low vacuum

1Pa

Height of Chamber

90mm

Max Temperature

450°C

Heating speed

Fastest can reach to 2°C /S ( Red copper heating platform)

Cooling speed

Fastest can reach to 2°C /S, Chamber with cooling water circulate

Lateral temperature difference

±5℃

Drawer loader weight

20KG

Power

Max:21.5KW, Working power:8-10KW

Heating Platform

Special treatment red copper platform

Power standard

380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire

Current

3 x40 A

Control way

Siemens PLC+IPC

Detail Display
 

Vacuum leak detector                     Detector of temperature curve

Main Festures Of  Vacuum Reflow Oven KD-V43

 
1.Void Less
Void reduction between the joining partner (<2%) to ensure better heat transfer (based on the device surface quality and the gas selection). If the void is less than 30%, the bonding strength increases.
 
2.Excellent temperature control
PLC and MFC architecture ensure consistency and precision temperature control, as well as reliable protection.
Water Cooling system : Cross-cooling tube and water cooling tank provide rapid cooling in high-temperature environments.

3.Very Short Soldering Times
The welding cycle time is short, about 10 minutes (380-450 °C soldering temperature, cooling temperature to 45 °C, nitrogen filling, welding vacuum is below 5-10-1 Pa).

4.Variation in process gas
Standard : 100% nitrogen is pumped into the vacuum chamber.
Option: HCOOH, ArH2 Plasma process gas, N2 & H2 forming gas.

5. Good human-machine interface
Windows provides system status queries, debugging/setting, alarms, and user interfaces.

6. Advanced PLC and Safe System:
The PLC system prevents accidental leaks, such as hydrogen leakage.
Alarms for excessive and ultultra-highmperatures
Low pressure warning system for cooling water
Protective covers for HCOOH tanks to prevent accidental explosions
System for detecting leaks of hydrogen gas and formic acid
Automatic pressure relief system in case of overpressure
A hydraulic pallet prevents water from damaging circuits
Automatic hydrogen burning prevents hydrogen pollution.
 

Applications of Vacuum Reflow Oven KD-V43

 
  • IGBT packaging
  • LED soldering (or LED soldering process)
  • Solder paste process
  • High-purity solder wafer process
  • Laser diode packaging
  • Mixed-signal integrated circuit packaging
  • Casing and lid packaging
  • Mems and vacuum packaging
 

Our Advantages

Here are some advantages of our reflow soldering machines:
 
  • Independent research software control system, arrange the internet of things system to factory of Power module packaging ,fully  cooperate with establish of customer’s MES system ，including : temperature control system, vacuum system and product process logic formulate.
  • Independent research and machining vacuum chambers and valves,  with rich experience for design , material choose, production process testing.
  • Our technical team with rich experience from SMT  to Semiconductor microchip package process ,including  Product welding, welding material, device surface treatment, setting of temperature and vacuum , and others.
  • Company have more than 200 workers ,Technical  R&D personnel more than 40,till now  with patent of invention 10, practical patents 20,1 software patent, 1 design patent , and patents in apply more than 15.
 
 
Frequently Asked Questions
 
1. What is reflow soldering machine?
 
Besides assembling PCBs, reflow equipment also provides soldering capabilities in both small and large assembly areas. Depending on your rework and assembly area, you can purchase smaller reflow ovens if you solder in a small PCB assembly area.
 
2. What are the components of reflow?
 
The reflow solder profile usually consists of four stages, namely preheating, thermal soak, reflow and cooling. During the preheating phase, heat is accumulated smoothly on the board and on the components. In order to prevent components from being damaged by too rapid temperature changes, a temperature gradient has to be observed.
 
3. What are the principles of reflow soldering?
 
Reflow soldering is based on the role of hot air flow on solder joints, colloidal flux in a fixed high temperature airflow under the physical reaction to achieve SMD welding, with the name"reflow soldering"given to a process in which high temperatures are achieved through gas circulation in the welder during welding.

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