Multi-layer Formic Acid Vacuum Soldering Reflow Oven For Power Module Device KD-V3 HVT

Name

Vacuum Reflow Oven

Model

KD-V3/V5

Welding size

V3 Single chamber, Platform size:400*500mm.Welding board size :350*450*100mm*3

V5   Single chamber, Platform size:400*500mm.Welding board size :350*450*100mm*5, Each chamber can work  independent

Oven size (LxWxH)

1400*900*2150mm/2600*900*2150mm

Weight

550 kgs/1100kgs

Heating Platform

3-layers metal heating platform ,water-cooled heating integrated structure design;;Each layer have shield plate insulation ,do not affect each other, can work at same time, or work independent

Heating way

Bottom red copper platform contact heating +Top infrared lamps assist heating

Gas

Nitrogen; Formic acid;HCOOH

Chamber

Each layer heating platform top height 100mm.

Control system

Temperature control system+Vacuum system+Cooling system+Atmosphere system+Software control system

Control way

 Brand LCD,IPC, PLC control system

Rated power

V3:45 KW; V5:70KW

Working power

V3:30KW;V5:45 KW

Vacuum speed

90 m³/h

Min vacuum

Below 10Pa(Mechanical pump)

Temperature range

Room-400℃

Bottom welding temperature

≥450℃

Platform heating speed

35-40℃ /min

Platform cooling speed

100-120℃/min

Temperature control deviation

≤±1℃

Temperature evenness

≤±1%

Chamber with watch window

Chamber with watch window

Power standard

380V, 3-phase five-wire

Process control of a power module device reflow oven:

1. Temperature gradient and time of each stage when soldering , can freely programming and save based on needed.

2.Can automatically generate all process curves, and edit the process program.

3.With digital gas mass flow controller, that can accurately control the process gas flow rate. 

Temperature correction function:

With intelligent temperature correction system ,that  can compensate for temperature difference.  900~950 mm(Need same with chip mounter ,can confirm by agreement).

Part of our advantage of multi-layer formic acid soldering reflow oven

1.Independent research vacuum chambers and valves,   with rich experience for design , material choose, production process testing.

2.Our technical team with rich experience from SMT  to Semiconductor circuit package process ,including  Product soldering , soldering  material, device surface treatment, setting of temperature and vacuum , and others.

3.Company have more than 200 workers ,Technical  R&D personnel more than 40,till now  with patent of invention 10, practical patents 20,1 software patent, 1 design patent , and patents in apply more than 15.