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Vacuum soldering oven

Inline 4-Chambers Vacuum Soldering Oven with Formic Acid KD-V400L

KD-V400L
Model: KD-V400L
Welding size: 350*400MM
Gas: Nitrogen; Formic acid
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 Vacuum Reflow Soldering Oven with Fomic Acid  KD-V400L

HVT inline 4 chamber vacuum soldering oven optimize  IGBT modules with solder paste or preforming solder and the exceptional soldering result void rate will less than 3%.

Technical Parameters

Name

Vacuum Soldering Systems

Model

KD-V400L

Welding size

350*400MM 

Oven size (LxWxH)

4200*1950*1900mm  Connected unloader size:5100*1950*1900 mm

Weight

3200 kgs

Heating zones

Front two preheating zones, Middle is Reflow zone, Behind are 4 Cooling chambers. Each temperature zone independent vacuum, Independent temperature control system. Products left in -right out, inline working.

Compatible Process

Solder paste and Preform solder

Gas

Nitrogen; Formic acid

Feed in and out

With 0.6m uploader,1.2m unloader , Air-cooling with time setting

Track

Length:465mm,Adjustable;Height:950±20mm;Carring capacity≥20kg

Effectively heating space

(420mm*220mm)*2 heating zone ,H≥80mm;

Height of Chamber

80mm

Max temperature of Preheating zone and Reflow zone

≥400℃;Accuracy:±1℃;

Bottom welding temperature

≥400℃

Top welding temperature

Max 300℃

Heating way

Bottom contact-type heating conduction

Cooling way

Bottom contact-type cooling

Type of Vacuum pump.  Speed

With 4 oil pump( 2 Preheating zones/Reflow zone/Cooling zone,) Speed ≥100m3/h;

Min Vacuum

2 Preheating zone/Reflow zone/ Cooling zone ≤1mbar; Within2h≤5mbar;

Speed of Heating and Cooling

Max heating speed≥3℃/s; Max cooling speed≥3℃/s。

Accuracy of Soldering temperature

Temperature of Reflow tray:±2%

Max hold time of reflow temperature

≥60min,(Max:999s);

Void Rate

Whole Void rate ≤2% Chip size (10mm*10mm),Sigle Void rate≤1% ,Chip size:(10mm*10mm)

Cooling Water

With independent circulating cooling water system

Temperature curve

Can setting self,(Add/Modify/Delete and so on)

Chamber with watch window

Chamber with watch window

Power

Max:35KW   Working powe:12-15KW

Heating platform

Red copper special treatment

Power standard

380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire

Gas

Nitrogen ,Formic acid

Control system

Siemens PLC1200 control system +YanHua IPC +Software operate

Detail Display

IGBT Module Vacuum Reflow Oven Customization:
 
  1. Maximizing Tray Space Utilization: Customizing tray space based on customer product dimensions to achieve maximum utilization.
  2. Hardware Adjustments for Increased UPH: Optimizing hardware components such as heating platforms and vacuum chambers to enhance production efficiency (UPH - Units Per Hour).

Main Features of Nitrogen Reflow Oven

Double-layer structure design:
 
  1. Upper layer (cover plate): Can be replaced and adjusted based on fixture requirements
  2. Lower layer (heating layer): 
  • Custom designed with 9 heating rods of 250W, divided into three groups, each group has 3 rods.
  • Custom designed with 9 heating rods of 250W, divided into three groups, each group has 3 rods.
  • Each group is equipped with a temperature-measuring thermocouple, positioned at the upper left, middle, and upper right respectively.
 
Problem Solved:
 
  • Effectively improves the edge temperature of the platform.
  • Temperature difference issue between the edge and the middle after long-term usage.
 
 

The benefits of a vacuum soldering oven

  1. Improved solder joint quality: The vacuum reflow soldering process reduces voids and defects in solder joints, resulting in higher reliability and better electrical and thermal performance.
  2. Reduced oxygenation: Vacuum environments reduce oxidation during soldering, improving solder wetting and overall solder joint integrity.
  3. Enhanced Solder Wetting: Due to a vacuum environment, solder can wet better with the component being soldered, resulting in a better solder joint.
  4. Lower soldering temperatures: Compared to traditional reflow soldering, vacuum reflow soldering uses lower soldering temperatures, reducing thermal damage.
  5. Flux Removal: Due to the lower pressure environment of vacuum reflow soldering, residual flux is easier to remove.
 

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