Hot-air Vacuum Reflow Oven KD-V8N/KD-V10N/KD-V12N
KD-V10N
The KD-V10N hot air vacuum reflow oven is a high-performance solution for laboratory and industrial applications, offering precise hot air reflow, adjustable temperature control, and low void soldering for PCB and semiconductor devices.
Quantity
Technical Process Of KD-V10N II Vacuum Hot Air Oven
The KD-V10N II Hot-air Vacuum Reflow Oven, developed by Chengliankaida Technology Co., Ltd., represents a cutting-edge solution for high-precision soldering processes. As a hot air oven for laboratory and industrial applications alike, the KD-V10N II is particularly suited for use in hot air reflow soldering of PCB, DCB, and semiconductor power devices. In a hot air oven used in laboratory settings, temperature control and soldering uniformity are critical. The KD-V10N II addresses these demands with adjustable parameters for vacuum pressure, holding time, and pump duration, ensuring precise process control at each stage.
Engineered for performance, this advanced hot air oven in lab environments offers stable transitions across heating, vacuum, and cooling zones. With a powerful vacuum pump and customizable cooling efficiency (0.5–6°C/s), it allows precise control of the temperature for hot air oven operations—delivering final product temperatures as low as ≤50°C. Optional multi-track systems significantly increase production capacity, making it ideal for both R&D labs and volume manufacturing.
Chengliankaida, a high-tech enterprise established in 2007 and based in Beijing, continues to lead the industry with innovations in vacuum welding and semiconductor packaging solutions. The company collaborates with IGBT industry alliances and universities to pioneer new technologies, with over 25 patents granted or pending.
- Can remove 99% voids and optimizes the quality of solder joints.
- A multi-track system is available as an option to increase production capacity.
- Stable track connection between heating, vacuum, and cooling to avoid pallet problems.
- Equipped with efficient vacuum pump.
- Suitable for PCB, DCB, shell and large area grounding & cooling, with hot melt large tools or fixture.
- Adjustable parameters: pumping time, vacuum holding time, inflating to normal pressure time, vacuum pressure.
- Cooling efficiency: cooling rate 0.5-6°C/S, can be configured according to customer product characteristics cooling length and cooling area, can make the product temperature ≤50°C.
Technical Parameters Of KD-V10N II Hot Air Oven For Laboratory
Equipment size | L7935*W1610*H1710 |
Effective soldering product size in vacuum chamber | ≤L450*W500 mm |
Effective soldering product size in non-vacuum zones | ≤L600xW515 mm |
Heating | Up +down heating |
Weight | Around 2500Kgs |
Qty of Preheating/Soldering/Vacuum zones | 7/3/1 |
Qty of cooling zones | ≤3 |
Temperature monitoring | Use K-type thermocouple |
Quantity of heating zones | ≤10 |
Length of heating zone | ≤4000mm |
Length of cooling zone | ≤1200 mm |
Cooling rate | ＜3℃/sec |
Heat exchange type | 100%hot-air convection |
Range of working temperature | ≤ 350°C |
Temperature control accuracy | ±1℃ |
Start-up time | ≤30 min |
Vacuum degree | ≤1 mbar |
Chain conveyor transport | Imported chain (specification 05B),automatic chain lubrication system, pin≥5mm |
Chain conveyor speed | 250～1500 mm/min |
Track adjustable width/control accuracy of width | Adjustable width 60~515 mm; control accuracy ≤1 mm |
Horizontal temperature uniformity of track | ±2℃ |
Board feed direction | Left- in ,right-out |
Height of soldering product | ＜60 mm |
Height of soldering product(up /bottom) | Up＜30mm ,bottom＜30mm |
Loading weight of track | ≤5 Kg/m |
Lifting speed of vacuum chamber | 3.3~50 mm/s |
Cooling type | Chiller |
Quantity and diameter of exhaust pipe | 3*Ø150 mm |
Temperature of exhaust pipe | <60 ℃ |
Operating software | Independent development, 23-inch touch screen |
Equipment operating software/communication interface | Chinese/English,SMEMA,RS485 interface |
Continuous working noise of equipment | < 70 dB |
Record and read production data | Support MES and SECSII/GEM,TCP/IP, Modbus/RTU |
Nitrogen connection size/required pressure | Interface outer diameter 16 mm air pipe; Pressure 6~8 Kg |
Oxygen monitoring point location/whether to configure oxygen analyzer | The sampling monitoring point is in the high temperature area; Equipped with a real-time oxygen monitoring analyzer |
Operating power | 54KW |
Totally power | 110Kw |
Applications Of KD-V10N II Industrial Hot Air Oven
Advantages of KD-V10N II Hot Air Oven in Lab Applications
- Designed and manufactured in strict accordance with advanced European and American equipment standards, this hot air oven used in laboratory environments features complete Chinese independent intellectual property rights. It can effectively reduce up to 99% of solder voids, ensuring high-quality results for hot air reflow processes.
- The system adopts a silent, vibration-free chain transmission. Single-track and double-track options are available, supporting heavy loads up to 5 kg and extra heavy loads up to 12 kg. Real-time board drop detection enhances process safety and stability in hot air oven for laboratory operations.
- It provides stable hot air volume with an adjustable fan frequency via frequency inverter. The sealed, maintenance-free fan motor ensures long-term reliability—guaranteed for 3 years—making it ideal for hot air oven in lab conditions requiring uninterrupted performance.
- With a cooling rate ranging from 0.5 to 6°C/s, the equipment can achieve an outlet temperature for hot air oven processes as low as ≤50°C, protecting sensitive components and improving thermal management.
- The industrial control system includes a computer capable of storing 1–2 years of soldering data, production recipes, real-time parameters, and alarm logs—supporting digital traceability and quality management in laboratory and production settings.
- Backed by a top-tier domestic technical team and a comprehensive after-sales service system, users benefit from continuous hot air oven in lab process optimization and technical support.
- Designed for efficiency, the oven features low operating costs, minimal energy and nitrogen consumption, and reduced usage of spare and wear parts—ideal for laboratories and production lines seeking sustainable and cost-effective hot air reflow solutions.
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