Inline Sintering System SN10
SN10
The SN10 Inline Sintering System is a compact, high-performance furnace for metal sintering. Compatible with silver paste, silver film, and copper paste, it features dynamic pressure loading, fast mold change, and low oxygen control. Ideal for debinding, microwave, and desktop metal sintering in industrial applications.
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Advantages Of Debinding And Sintering Furnace SN10
Advanced Solution for Precision Power Module Sintering
The SN10 Inline Sintering System is a highly integrated, compact sintering platform engineered for the packaging of power semiconductor modules. With cutting-edge features like multi-material compatibility, low oxygen control, and high-pressure hydraulic bonding, it is well-suited for high-reliability industries including automotive electronics, photovoltaics, and renewable energy.
Key Advantages of SN10 Inline Sintering System
Compact and Exquisite Design
Footprint less than 4㎡ with dimensions of 2500×1800×1700 mm — ideal for flexible factory layouts or integration with desktop metal sintering furnace setups.
Multi-Material Compatibility
Supports mainstream bonding materials including silver paste, silver film, and copper paste, just like traditional metal sintering furnace solutions.
Dynamic Pressure Head
Independent floating design ensures pressure balance with a height variation ≤ 1.5 mm.
Extremely Fast Mold Change
Modular design enables mold changes in under 25 minutes using an optional mold-change tool cart.
Low Oxygen Control
Oxygen levels precisely controlled between 100–1000 ppm to suppress oxidation and discoloration during sintering — a clear advantage over standard debinding and sintering furnace units.
Hydraulic Drive for High Pressure Sintering
Loading force range from 30 MPa to 49 MPa, supporting large-area sintering and high bonding reliability.
Intelligent Control System
Customizable process parameters with one-click process merging; simple operation and full data traceability.
Technical Parameters Of Microwave Sintering Furnace SN10
Serial | Technical Parameter | Equipment performance |
1 | Sintering area | 380mm*440mm |
2 | Chip loading pressure | 5 MPa-30MPa |
3 | Precision of chip loading pressure | ±0.2 MPa |
4 | Preheating station (optional) temperature | 20℃ - 250℃ |
5 | Temperature control accuracy of preheating station | ±1℃ |
6 | Preheating (working hours) | >10s |
7 | Sintering station mold temperature | 200℃-350℃ |
8 | Temperature control accuracy of sintering station mold | ±1℃ |
9 | Sintering station (working hours) | >10s |
10 | Cooling chamber, cool down to | ≤ 45℃ |
11 | Cooling station (working hours) | 10s–900s |
12 | Sintering environment | Fully enclosed nitrogen environment |
13 | Film covering method | Automatic laminating |
Application Scenarios Of High Temperature Sintering Furnace SN10
The SN10 system meets the technical and environmental requirements of various high temperature sintering furnace tasks. Its adaptability makes it a competitive option for replacing traditional microwave sintering furnace and debinding and sintering furnace solutions in:
- Power semiconductor module packaging
- Wide bandgap device bonding (SiC, GaN)
- Photovoltaic and new energy power control units
- Aerospace and automotive electronic sintering
Why Choose Metal Sintering Furnace SN10?
While traditional metal sintering furnaces and microwave sintering furnaces offer general sintering capabilities, the SN10 provides inline automation, precision control, and multi-material bonding support — making it more suitable for high-reliability, high-yield, and data-traceable manufacturing environments.
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